Principal Hardware Engineering Manager (BB-C6E47)

Found in: Neuvoo AU


Microsoft Quantum has assembled a talented and diverse international team to create the world’s first scalable quantum computing system. Our full-stack approach involves exciting innovation from the physics at the quantum plane to providing global quantum services. The Microsoft Quantum program strives to fundamentally change the world of computingin order tohelp solve humankind’s currently unsolvable problems. We are on the cusp of an accelerated effort in quantum computing. This position offers an opportunity to have a meaningful influence on a revolutionary technology. The research effort includes a diverse staff of theoretical and experimental physicists, hardware designers and software engineers around the world. Our Sydney lab, based at the University of Sydney, is looking for an experiencedengineertomanage process development,packaging,and theoperationsofa state-of-the-art cleanroom facility.



You will leada smallteam of engineersto develop packaging and electrical interconnect strategies for quantum circuits and their classical controllers. You willmanage a state-of-the-art packaging laband nanofabrication process developmentin Sydney. You will interact closely with other quantum engineers and developers in Sydney and at other labsat Microsoft.You will be responsible for contributing to the technical direction of the research based on experimental results, program needs and the input from cross-functional colleaguestoaddress packaging challenges for scaling quantum machines.

Key Responsibilities include:

  • Manage a team ofpackaging and process development engineers.
  • Design, prototype and test novel packaging techniquesfor scalable quantum control and readout.
  • Communicate with the broader team at Quantum Sydney aroundpackagingand processstrategy andmanagethedevelopment ofsolutions for quantum computing and its control systems. 
  • Qualifications



  • or degree with background in Engineering (Chemical, Mechanical, Electrical), Materials Science, Chemistry, Physics, or related technical fields
  • 8+yearsofexperience in semiconductorpackagingor process development.
  • 3+ years ofpeoplemanagement experience.
  • Desired Skills:

  • Experience with controlled collapse chip connections (C4) including flip-chip modules, interposers, bump fabrication,designand advanced wire-bonding approaches.
  • Hands-on experience in process technology development, including process integration, preferably in an advanced Integrated Circuit (IC) cleanroom technology developmentormanufacturingenvironment.
  • Knowledge of printed circuit boards, multi-chip modules, small footprint connectors, and high-density cabling solutions.
  • Experience with radio frequency / microwave chip-scale interconnects, their design and characterization.
  • Experience with and knowledge of chip-stacking technologies and interconnects such as through-silicon vias (TSVs). 
  • Knowledge of state-of-the-art approaches and limitations of high-density interconnects.
  • Knowledge of cryogenic devices, cryogenic detectors, or cryogenic electronics. 
  • Experience with processing III-V material systems and superconducting materials
  • Front End of Line (FEOL) and Back End of Line (BEOL) process technology development experience
  • Critical and creative thinking, intellectual curiosity, strong track record of structuring and solving complex problems.
  • Excellentverbal, visual, and written communication skills.
  • Strong structured problem-solving skills (such as Design of Experiments) and the ability to use data analysis techniques (such as JMP, SAS or similar tools) to guide decision making.
  • #quantum



    Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

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    info Full-Time

    location_onSydney, Australia

    work Microsoft

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